Industrial manufacturers are increasingly using X-ray inspection to examine the internal structure of products without cutting them open, a requirement that has become more critical as electronics, batteries and automotive parts grow more complex. One high-resolution configuration combines a 90 kV closed-tube source with a 5-micron focal spot and a flat-panel detector, according to technical specifications for the system. The equipment is designed to detect small defects while maintaining routine throughput and operator safety.
High-resolution imaging in a compact configuration
The system pairs a 90 kV closed-tube X-ray source with a 5-micron focal spot, a combination intended to produce sharp images of fine internal features. A high-resolution flat-panel detector captures the X-ray image, while an industrial-grade PC and image-processing software handle acquisition and analysis.
The imaging chain supports magnification up to 200X and uses a three-axis motion system for X, Y and Z positioning. The maximum object area is 350 by 375 millimeters, with a maximum inspection area of 330 by 350 millimeters, according to the specifications.
| Specification | Technical parameter |
|---|---|
| X-ray source | 90 kV closed tube, 5-micron focal spot |
| Magnification | 200X |
| Motion control | 3-axis (X/Y/Z) |
| Maximum object area | 350 mm × 375 mm |
| Maximum inspection area | 330 mm × 350 mm |
Operational features and safety
Beyond imaging performance, the system includes high-definition camera navigation and laser positioning to help operators locate and track target areas. The three-axis motion system, together with an optional 360-degree tilting fixture, is designed to allow inspection from multiple angles.
On safety, the equipment is described as complying with FDA-CDRH standards under 21 CFR 1020.40, Subchapter J. Radiation leakage is controlled below 1 microsievert per hour, according to the specifications, a level intended to protect operators during routine use.
Industrial applications
The combination of high resolution and a flexible object stage makes the system suitable for several inspection environments. In electronics manufacturing, it can be used for SMT, BGA, CSP, Flip Chip and other component inspection.
Other applications include battery production, semiconductor packaging and LED inspection, as well as aluminum die castings, plastic molds, ceramic products and automotive parts. The object area and inspection area specifications should be checked against the dimensions of the parts to be tested.
- Electronics manufacturing: SMT, BGA, CSP, Flip Chip and other electronic components.
- Energy and semiconductors: battery production, semiconductor packaging and LED inspection.
- Industrial manufacturing: aluminum die castings, plastic molds, ceramic products and automotive components.
