In today's rapidly evolving manufacturing landscape, stringent quality control has become the lifeline for business survival and growth. Particularly in electronics assembly and precision component manufacturing, microscopic defects often serve as the root cause of product failures. Traditional visual inspection or low-magnification imaging methods increasingly fall short of meeting today's precision requirements. This is where high-performance, accurate, and cost-effective offline X-ray inspection systems emerge as critical tools for enhancing product yield and optimizing production workflows.
The X6600 represents more than just an X-ray machine—it's a quality control partner integrating advanced imaging technology with intelligent analysis capabilities. Designed as a versatile offline micro-focus X-ray inspection system, the X6600 addresses common industrial inspection challenges while demonstrating unique advantages in high-precision micro-defect detection.
- High Magnification & Micro-Focus Technology: Equipped with an advanced micro-focus X-ray tube generating focal spots as small as 5-15μm, combined with a high-resolution TFT industrial dynamic flat panel detector achieving 5.8Lp/mm resolution.
- Multi-Angle Scanning: Overcomes traditional single-view limitations through tilt-capable scanning, particularly effective for complex structures like BGA solder joints and QFN pins.
- Large Inspection Platform: Accommodates samples up to 540mm×440mm while maintaining high-resolution imaging across large surface areas.
- Cost-Effective Solution: Delivers high performance without specialized customization requirements, offering exceptional value for budget-conscious operations.
The X6600's strengths extend beyond hardware to sophisticated software algorithms and intelligent functions enabling efficient automated inspection.
- CNC Automated Inspection: Programmable multi-point array testing with precise motion control ensures consistency and repeatability.
- Automatic Defect Recognition (ADI): Advanced image processing identifies and quantifies common soldering defects while minimizing human interpretation errors.
- Customizable Image Algorithms: Tailored software solutions address specific product characteristics and inspection requirements.
- BGA Solder Ball Inspection: Optimized functionality for ball grid array components includes individual/matrix analysis and automated marking.
- Void Ratio Calculation: Automated quantification of solder joint void percentages provides reliable quality metrics.
- Comprehensive Safety: Multi-layer radiation protection with real-time monitoring ensures operator safety below 1μSv/h leakage levels.
- Type: Sealed micro-focus X-ray tube
- Voltage Options: 90KV or 130KV configurations
- Operating Range: 40-90KV/130KV voltage, 10-200μA/300μA current
- Maximum Output: 8W/39W power
- Focal Spot: 5-15μm
- Type: TFT industrial dynamic FPD
- Resolution: 1536×1536 pixel matrix, 5.8Lp/mm
- Field of View: 130mm×130mm
- Frame Rate: 20fps (1×1 binning)
- Dynamic Range: 16-bit A/D conversion
- Dimensions: 1360mm×1240mm×1700mm
- Power: 220V 10A / 110V 15A, 50-60Hz
- Maximum Sample Size: 540mm×440mm
- Control System: Industrial PC (Win7/Win10 64-bit)
- Weight: 1170kg
- Tilt Capability: 65° maximum angle
The X6600 serves diverse industrial inspection needs including:
- PCB assembly (solder defects, component placement)
- Semiconductor packaging (BGA, CSP, QFN interconnects)
- Precision components (porosity, cracks, structural integrity)
- Energy storage systems (battery internal structures)
- Aerospace/automotive critical components
Developed by a leading X-ray inspection equipment manufacturer, the X6600 benefits from extensive technical expertise in non-destructive testing solutions. The engineering team provides comprehensive support from system selection through post-installation maintenance.
Facing simultaneous pressures for higher quality and lower production costs, manufacturers will find the X6600's balanced performance, adaptability, and competitive pricing make it a compelling solution for precision micro-focus X-ray inspection requirements.
