bga x ray machine
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Sistema de inspección de SMT BGA X Ray
BGA X Ray Inspection Machine with integrated generator for SMT Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 80kV/90kV Max.Power 12W/8W Spot Size 5μm/15μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 160 X/360X Detection Region Max.Loading Size 440mm x 400mm Max.Inspection Area 420mm x 380mm X-ray Leakage
Propietario 80/90 kilovoltios de la fuente de Unicomp de máquina de radiografía con tamaño de punto focal del submicron
Proprietary 80 / 90 kV source with submicron focal spot size X Ray Machine FEATURES: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, X-Y multi-axis movement. ±60° "Arc" motion(Option). Motion controls include: X/Y table motion plus Z axis tube and detector movement, ±60° tilt motion (option). Multi-function DXI image processing system. X/Y programming function for multiple image inspection routines Max. loading area 420mm x 420mm, max. detection area 380 x
Máquina del metal X Ray de UNICOMP para la conectividad y el análisis AX9100 de BGA
Metal X Ray Machine for BGA connectivity and analysis AX9100 Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage
Unicomp AX9100 X Ray Machine SMT PCBA BGA LED QFN que suelda la medida vacía
SMT PCBA BGA LED QFN Soldering void measurement by Unicomp AX9100 X Ray Machine Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ●
Inspección en tiempo real de los defectos de AX7900 Digitaces X Ray Machine For Switch Inner
Real Time Digital X-Ray Machine AX7900 for Switch Inner Defects Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC/50Hz
Inspección en tiempo real del defecto de AX7900 Digitaces X Ray Machine For Electronics Inner
AX7900 Real Time Digital X Ray Machine For Electronics Inner Defect Inspection APPLICATION of IC Xray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
Inspección off-line auto en tiempo real del defecto de AX7900 X Ray Machine For Electronics Inner
AX7900 Real Time Auto-Offline X Ray Machine For Electronics Inner Defect Inspection APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power
Máquina en tiempo real de Digitaces X Ray AX7900 para la inspección interna de los defectos de PCBA
Unicomp factory supply quality control X-ray inspection machine for SMT industry APPLICATION of X-ray machine AX7900: LED, SMT, BGA, CSP, Flip Chip Inspection. Semiconductor, Packaging components, Battery Industry. Electronic components, Auto parts, Photovoltaic Industry. Aluminum Die Casting, Moulding Plastic. Ceramics, Other Special Industries Technical Specifications of AX7900 Item Definition Specs System Parameters Size 1100(L)x1100(W)x1500(H)mm Weight 1000kg Power 220AC
AX7900 Electrónica Máquina de rayos X con ángulo de inclinación de ± 25° para obtener un mejor resultado de inspección
The Most Economic X-Ray inspection machine AX7900 with high performance Description of IC X Ray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max. loading area
