bga x ray machine
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CSP LED 110kV X Ray Scanner 5um para soldar de la tira PCBA del LED
110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size
Máquina de rayos X de alta resolución Unicomp AX7900 con tubo de 5um para pruebas de curvatura de cables de unión BGA
90kv X ray machine high resolution Unicomp AX7900 with 5um tube for BGA bonding wires curvature testing Description of IC X Ray machine AX7900: It is broadly utilized in industries such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Batteries, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, and Photovoltaics, among others. FEATURES of IC Xray machine AX7900: Large Size Inspection Table Laser Pinpoint For Precise Location
Unicomp Microfocus X Ray Inspection System 130kV 3um para la imagen de FPD
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ● Semiconductor, Packaging components, Battery Industry. ● Electronic components, Auto parts, Photovoltaic Industry. ● Aluminum Die-casting, Moulding Plastic. ● Ceramics, Other Special Industries. Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power
reforzador de 130kV 3um Microfocus X Ray FPD para soldar de aluminio de PCBA
CE/FDA Certificated Unicomp AX9100 X-Ray Inspection Machine For Computer Mother Board Chipset BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●
Tubo Unicomp X Ray AX7900 0.8KW de PCBA 5um para la asamblea del PWB
Unicomp 5um close tube AX7900 X-ray for printed circuit board assembly PCBA process quality inspection of Void Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
Semiconductor de SMT BGA de la electrónica del equipo de la detección de la radiografía del poder más elevado
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
CE del túnel de la inspección X Ray Chip Counter 440m m de SMT BGA
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
CSP 130kV X Ray Security Scanner Auto Inspection para el NDT de cerámica
130kV clsoed tube X-ray system with convenient mapping process for ceramic NDT quality testing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage
Equipo de inspección de rayos X con diseño de tubo sellado de fuente de alimentación AC 110/220V
X-Ray Inspection Equipment Product Description: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features: Large Size Inspection Table. Laser Pinpoint For Precise LocationLarge Size Inspection Accurate Control, CNC Programming Automatic Positioning FPD Tilting ±25° Safely Electromagnetic Interlock Fingerprint Access
