pcb x ray inspection
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el soldar de la electrónica X Ray Machine For SMT BGA de 0.8kW 5um FDA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
Máquina de rayos X en tiempo real con tubo de rayos X de enfoque de 5 micras para comprobar las bolas de soldadura BGA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
6 Ejes Máquina automática de radiografía de rayos X 2D CNC para huecos BGA Medición automática
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Máquina integrada de SMT/el ccsme X Ray del generador con la cadena de alta resolución de la proyección de imagen
Metal X Ray Machine with integrated generator & a high-resolution imaging chain The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
Máquina de Benchtop X Ray del laboratorio para el LED/el microprocesador de tirón/el semiconductor
Laboratory Benchtop X Ray Machine for PCB , LED , Flip Chip , Semiconductor Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray
Equipo de la inspección del NDT del vacío de la electrónica X Ray Machine BGA QFN LED del PWB del ccsme que suelda SMT
Unicomp EMS, SMT, PCB, Electronics, Semicon X Ray NDT Inspection Machine for BGA, QFN, LED Soldering Void, Wire bonding Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Application Fields of X Ray Machine AX8200Max SMT/PCBA Inspection Semiconductor Inspection Lithium Batteries Inspection LED Inspection Photovoltaic
Máquina de rayos X de tubo de tamaño de punto de enfoque de micrones de 130KV AX9100MAX con dos computadoras para la inspección de PCB y BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Tablas electrónicas de altas especificaciones Máquina de rayos X 2D y 2.5D Unicomp AX9100MAX con tabla de rotación de 360 grados para inspección de BGA y PCB
It enjoys broad utilization across diverse domains including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small-scale Metal Casting, Electronic Connector Modules, Cables, and the Photovoltaic Industry, among others. Application Fields Functions and Feature Inspection Image System Summary Footprint 1455(W)×1760(D)×1945(H)mm Machine Weight 2400 kg Power Supply AC 110~220V, 50/60Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight
China Unicomp AX8200 BGA/IC/PCB cerró la máquina de radiografía con precio de fábrica
Smt X-ray Closed 5g Chipset Electronic Connector Module Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the
