real time x ray system
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Inspección de la exhibición 1.0kW X Ray Inspection Machine Unicomp AX8200 BGA del LCD
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Electrónica X Ray Machine UNICOMP CX3000 de CSP para el conector de cable
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Applications BGA Inspection Inspection of over molded electrical connectors Encapsulated components Aluminum die castings Molded plastic components Ceramics Aerospace components Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection The AX-8200 machine is designed to provide high
trazado del CNC de la batería de litio 1uSv/H X Ray Inspection Equipment BGA
SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Inspección con rayos X para el control de PCB Fugas de rayos X 1uSv/h Voltagem 0-110kV Ajustable
X-Ray Inspection for PCB Quality Control Application of SMT X-Ray machine Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. FEATURES of Desktop X-ray machine Large Size Inspection Table with 360° rotation Laser Locator for Precise Location Maganification (1000X) Accurate Control, CNC Programming Automatic Positioning FPD 55°
Hierro dúctil NDT X Ray Equipment Low Breakdown UNC450 para el bastidor de aluminio
UNC450 Ductile Iron NDT Real Time Imaging Unicomp X-ray Inspection Machine Features: ● High reliable and long life,low breakdown; ● High definition and resolution FPD; ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend); ● Multi-functional workstation,360°rotation and shift; ● User friendly software design for easy interfacing can facilitate,customized software ; ● High penetration,Voltage up to 450KV,Maximum penetration thickness
Radiografía de Unicomp AX8500 110kV 5um 2.5D para el control de la calidad de SMT PCBA BGA IC de la electrónica que suelda
Unicomp AX8500 110kV 5um 2.5D X-ray for Electronics SMT PCBA BGA IC soldering quality check Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
radiografía de los 5μm Microfocus con FPD 55° que inclina la visión para examinar vacío que suelda de PCBA BGA QFN LED
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel
máquina Unicomp AX8500 del rayo de 2.5D 110kv X para la calidad del leadframe de Semicon que comprueba con la medida auto
2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
CSP LED 110kV X Ray Scanner 5um para soldar de la tira PCBA del LED
110kV 5um microfocus AX8500 X-ray for LED Strip PCBA soldering void quality control Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size