x ray imaging system
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Control-X programable Ray Machine 8KW Unicomp UNC225 del CNC
Cast Parts Industrial X Ray Machine Real Time Imaging Inspection UNC225 UNC225 is a robust, reliable industrial X-ray inspection system for broad applications in foundries, R&D, laboratories, universities, and educational institutions. The system delivers brilliant image quality with digital flat-panel detector and highly dynamic radioscopy. Smart ergonomics for easy operation Tailor-made configuration for wheels and tires Renowned, robust, reliable digital X-ray inspection
Sistema de rayos X Unicomp AX9100max para la inspección de defectos internos de los componentes electrónicos
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Máquina de rayos X de PCB de alta magnificación Unicomp AX9100MAX para la inspección de alambres de unión de componentes electrónicos de IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.
Inspección automática CNC programable Máquina electrónica de rayos X AX9100MAX con ángulo de inclinación de 60° para la medición de la curvatura del IC
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Tamaño del punto de enfoque de micrones de la máquina de rayos X de SMT PCB para medición de huecos BGA e inspección de la altura de subida de la soldadura pasada
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Máquina de rayos X de tubo de tamaño de punto de enfoque de micrones de 130KV AX9100MAX con dos computadoras para la inspección de PCB y BGA
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Tablas electrónicas Máquina de rayos X 2D y 2.5D AX9100MAX con tabla de rotación de 360 grados para BGA&PCB
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Equipo de rayos X para la detección de defectos internos en las pastillas de freno
Unicomp UNC160 X-Ray for detecting internal defects in brake pads Product Description: Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features: Widespread Applications: Large inspection size and loading weight capacity Safety Standard: High level protection with international standard, multiple safety set up Image Proccessing:
Detecta fallas internas en las pastillas de freno con el equipo de rayos X Unicomp UNC160
Detect Internal Flaws in Brake Pads with Unicomp UNC160 X-Ray Product Description: Mainly used in all kinds of metal castings, hardware products, plastic products, refractory materials, review materials, ceramic body and metal parts welding and other products for non-destructive. Features: niversal Applications: Capable of inspecting large sizes and heavy loads. Safety Compliance: Meets international standards with robust safety measures. Image Processing: High-quality, swift
