x ray machine for manufacturing
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Sistema SMD X Ray Chip Counter 1.1kW del ERP con la bobina 4
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Monitor LCD del túnel de Unicomp SMD PCBA X Ray Chip Counter 440m m
Features ● Automatic inspection, no need on programs switch for different components ● Fast speed and high accurate chip counting, reducing labor costs ● No chip damage or lost with non-destructive counting ● Compatible with 7”~17” tape & reels ● Automatic link with ERP & MES System, and storage system ● Shielded cabinet protection to guarantee Safety leakage of X-ray ● Fast counting Speed:12~13s/Reel ● Inspection Accuracy: ≥99.9% ● Min. Package: 01005 ● One-button operation,
Área de detección efectiva 129x129mm Equipo de inspección de rayos X para navaja eléctrica 1280x1220x1615mm
X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization
Equipo de inspección de rayos X para PCBA de tamaño de punto de enfoque de 5 μm Capacidad de 1100 kg
X-Ray Inspection Equipment for PCBA Description of IC X Ray machine AX7900: It is widely employed across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC
Equipo en tiempo real UNI160-Y2-D9 de X Ray de la alta definición para la industria aeronáutica
Unicomp Inline Wheel Hub NDT X-ray Inspection System workshop UNI160-Y2-D9 Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. Technical parameter Inspection range:13"-22" ; 14"- 26"wheel hubs Inspection speed:≤35
Solo haz Unicomp X Ray Stainless Steel Ball 40-120kV con software
Max Voltage: 40-120kV Max Current: 0.2-7.5mA Dimension(WxDxH,mm): 1600x790x1800 Weight: 500kg Inspection Accuracy(mm): Stainless Steel Ball ø0.5,Stainless Steel Wire 0.2x1.5, Glass2.0,Plastic 1.5 Safety:
Máquina de rayos X de 160KV UNT Unicomp UNC450 para ensayos no destructivos de cilindros, piezas fundidas de metales, piezas aeroespaciales
160KV NDT Xray machine Unicomp UNC450 for cylinder,metal castings, aerospace parts non-destructive testing Product Description: The specialized equipment serves as a cornerstone for non-destructive testing across a vast array of materials and products. It is extensively employed to scrutinize metal castings, verifying the structural integrity of intricate metal components. Moreover, it covers a wide spectrum of hardware products, from basic nuts and bolts to intricately
10-50m/ Comida de Unicomp y equipo mínimos de la bebida X Ray para la detección confiable
Unicomp X-ray inspection systems for dependable detection of foreign material Unicomp X-ray inspection system scans for contaminants and checks for foreign bodies in dry bulk powders, baking and snack products, cereal and crackers. It detects and automatically rejects contaminants, including glass shards, metal fragments, mineral stone, and some plastic and rubber compounds. The system includes software that collects data that can be stored centrally and used with optional
Semiconductor de SMT BGA de la electrónica del equipo de la detección de la radiografía del poder más elevado
High Power X-ray Detection Equipment Electronics SMT BGA Semiconductor Today, Unicomp Technology has three R&D /Manufacturing sites exceeding 25,000m2 respectively located at Wuxi/Jiangsu Province, Shenzhen/Guangdong Province, and Chongqing. Our sales and service centers are located all across China including Beijing, Shenyang, Tianjin, Xi'an, Qingdao, Wuhan, Chengdu, Ningbo , Xiamen and etc. The company has also penetrated into the international market with sales and service
