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Auto Void Detection Xray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment Unicomp

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX8300
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: T/T, L/C
Capacidad de suministro: 30 juegos por mes
Resumen del producto
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring ...

Detalles del producto

Resaltar:

Auto Void Detection Xray Machine

,

BGA Solder Joint Testing Equipment

,

High Motion Precision Xray Machine

Product Name: AX8300
Dimension: 1215*1325*1700(milímetro)
Power Supply: 220 V, 50 Hz/60 Hz 4 A.
Weight: 1350 kg
Voltage: 110kV
Warranty: 1 año
Descripción del Producto
Auto Void Detection X-ray Machine AX8300 High Motion Precision BGA Solder Joint Testing Equipment by Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to
Calificación General
5.0
★★★★★
★★★★★
Basado en 50 reseñas recientes
de cinco estrellas
100%
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  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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