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Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX8300MAX
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: T/T, L/C
Capacidad de suministro: 30 juegos por mes
Resumen del producto
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...

Detalles del producto

Resaltar:

Semiconductor BGA X-ray inspection machine

,

Flip Chip X-ray machine 5μm resolution

,

UNICOMP X-ray machine with warranty

Model: AX8300MAX
Motion Control Mode: Ratón y teclado y palanca de mando
Tilt And Rotation: Detector de inclinación unilateral máxima 60°
Monitor: Pantalla HD 4K de 27"
System OS: Windows11 de 64 bits
Power Consumption: 900W
Tube Type: Sellado
Descripción del Producto
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings
Calificación General
5.0
★★★★★
★★★★★
Basado en 50 reseñas recientes
de cinco estrellas
100%
4 estrellas
0
3 estrellas
0
2 estrellas
0
1 estrella
0
Todas las reseñas
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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