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5μm Minimum Resolution CNC Electronic BGA Package AX8300MAX Unicomp Missing Solder Ball QC Detector

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX8300MAX
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: T/T, L/C
Capacidad de suministro: 30 juegos por mes
Resumen del producto
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection ...

Detalles del producto

Resaltar:

5μm resolution BGA detector

,

CNC electronic BGA package

,

missing solder ball QC detector

Model: AX8300MAX
Motion Control Mode: Ratón y teclado y palanca de mando
Tilt And Rotation: Detector de inclinación unilateral máxima 60°
Monitor: Pantalla HD 4K de 27"
System OS: Windows11 de 64 bits
Power Consumption: 900W
Tube Type: Sellado
Descripción del Producto
AX8300MAX Unicomp Missing Solder Ball QC Detector This advanced industrial X-ray inspection system delivers 5μm minimum resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of: Semiconductor packaging devices including BGA, CSP, LED and flip chip Automotive electronic components New energy core
Calificación General
5.0
★★★★★
★★★★★
Basado en 50 reseñas recientes
de cinco estrellas
100%
4 estrellas
0
3 estrellas
0
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1 estrella
0
Todas las reseñas
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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