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High Resolution For PCBA BGA Solder Quality Test X‑ray Equipment UNICOMP AX9100MAX SMT IC Inspection System

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX9100 máximo
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: LC, T/T
Capacidad de suministro: 30 juegos por mes
Resumen del producto
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of ...

Detalles del producto

Resaltar:

PCBA BGA solder test X-ray equipment

,

SMT IC inspection X-ray machine

,

high resolution X-ray equipment for PCBA

Machine Type: Sistema electrónico de inspección por rayos X de semiconductores
Model: AX9100 máximo
X-Ray Tube Type: Tipo sellado
Pixel Size: 84 μm
Pixel: 1536*1536
Footprint: 1450 (ancho) × 1765 (profundidad) × 1835 (alto) mm
Descripción del Producto
UNICOMP AX9100MAX X-Ray Inspection System High-resolution X-ray equipment for PCBA BGA solder quality testing and SMT IC inspection with advanced non-destructive testing capabilities. System Overview This advanced X-ray inspection system is designed for high-precision non-destructive testing of electronics IC components and bonding wire analysis. It is widely deployed across industrial and semiconductor applications for quality control and R&D verification. Applications BGA,
Calificación General
5.0
★★★★★
★★★★★
Basado en 50 reseñas recientes
de cinco estrellas
100%
4 estrellas
0
3 estrellas
0
2 estrellas
0
1 estrella
0
Todas las reseñas
  • J
    J*n
    United States Jan 21.2026
    ★★★★★
    ★★★★★
    NICE
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