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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX9500
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: T/T, L/C
Capacidad de suministro: 300 juegos por mes
Resumen del producto
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and ...

Detalles del producto

Resaltar:

FPD SMT X-ray inspection machine

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BGA packaging X-ray machine

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Unicomp AX9500 X-ray inspection

Name: Máquina de la inspección de la radiografía de Unicomp
Application: SMT, el ccsme, BGA, electrónica, CSP, LED, Flip Chip, semiconductor
Industry: Industria de electrónica
X-Ray Leakage: < 1uSv="">
Descripción del Producto
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT). Applications Semiconductor industry SMT
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