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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX9500
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: T/T, L/C
Capacidad de suministro: 300 juegos por mes
Resumen del producto
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, ...

Detalles del producto

Resaltar:

FPD detector BGA defect analysis

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Unicomp SMT welding system

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X-ray head-in-pillow inspection

Name: Máquina de la inspección de la radiografía de Unicomp
Application: SMT, el ccsme, BGA, electrónica, CSP, LED, Flip Chip, semiconductor
Industry: Industria de electrónica
X-Ray Leakage: < 1uSv="">
Descripción del Producto
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities. Applications Semiconductor industry inspection SMT
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