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110KV X-ray Inspection for BGA with AI-Powered Automatic Void Detection Unicomp AX8300MAX

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX8300MAX
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: T/T, L/C
Capacidad de suministro: 30 juegos por mes
Resumen del producto
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. ...

Detalles del producto

Resaltar:

110KV X-ray BGA inspection machine

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AI-powered automatic void detection X-ray

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Unicomp AX8300MAX X-ray electronics

Model: AX8300MAX
Motion Control Mode: Ratón y teclado y palanca de mando
Tilt And Rotation: Detector de inclinación unilateral máxima 60°
Monitor: Pantalla HD 4K de 27"
System OS: Windows11 de 64 bits
Power Consumption: 900W
Tube Type: Sellado
Descripción del Producto
UNICOMP AX8300MAX X-ray Inspection System Advanced 110KV industrial X-ray inspection system with AI-powered automatic void detection, specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic
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