logo
Bienvenido a Unicomp Technology
+86-13502802495

Unicomp AX8300MAX 110KV X-ray Inspection for BGA One-Click Automated Void Detection

Propiedades básicas
Lugar de origen: Porcelana
Nombre de la Marca: UNICOMP
Certificación: CE, FDA
Número de modelo: AX8300MAX
Propiedades comerciales
Cantidad mínima de pedido: 1 juego
Precio: can negotiate
Condiciones de pago: T/T, L/C
Capacidad de suministro: 30 juegos por mes
Resumen del producto
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable ...

Detalles del producto

Resaltar:

Unicomp AX8300MAX X-ray inspection machine

,

BGA automated void detection X-ray

,

110KV X-ray machine for electronics

Motion Control Mode: Ratón y teclado y palanca de mando
Tilt And Rotation: Detector de inclinación unilateral máxima 60°
Monitor: Pantalla HD 4K de 27"
System OS: Windows11 de 64 bits
Power Consumption: 900W
Descripción del Producto
Unicomp AX8300MAX 110KV X-ray Inspection System Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Features 60° tilt and 360° rotary stage for BGA and HIP (Head-In-Pillow) inspection. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and
Productos relacionados

Enviar una consulta