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Máquina de la electrónica X Ray

Calidad Conectores del arnés de la electrónica X Ray Machine Closed Tube Cable de Unicomp AX8200 Fábrica

Conectores del arnés de la electrónica X Ray Machine Closed Tube Cable de Unicomp AX8200

Cable Harness Connectors Quality Inspection by Unicomp AX8200 Microfocs X-ray with high resolution FPD Applications: BGA , CSP , LED , Flip Chip , Semiconductor, Battery Industry , Small Metal Casting, Electronic Connector Module, Aerospace Components , Photovoltaic Industry, The AX-8200 machine is ...
Calidad Electrónica X Ray Machine 5um AX8500 del semiconductor 110kV para PCBA BGA Fábrica

Electrónica X Ray Machine 5um AX8500 del semiconductor 110kV para PCBA BGA

110kV 5um Microfocus X Ray Machine with high resolution FPD AX8500 For PCBA BGA void Inspection Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
Calidad Electrónica X Ray Machine 110kV Unicomp AX8500 de CSP SMT para SMT PCBA BGA QFN Fábrica

Electrónica X Ray Machine 110kV Unicomp AX8500 de CSP SMT para SMT PCBA BGA QFN

Unicomp 2D AX8500 110kV Closed Tube X-ray for SMT PCBA BGA QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...
Calidad CNC de 5um SMT X Ray Equipment programable para los vacíos del ccsme BGA Fábrica

CNC de 5um SMT X Ray Equipment programable para los vacíos del ccsme BGA

5um Microfocus X Ray Machine with CNC Programmable inspection For SMT EMS BGA Voids checking Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing ...
Calidad Electrónica X Ray Machine 1.0kW del algoritmo FPD para la soldadura del flujo del LED Fábrica

Electrónica X Ray Machine 1.0kW del algoritmo FPD para la soldadura del flujo del LED

Unicomp newly released AX8200max X-ray machine with cutting-edge software algorithm for SMT BGA CSP QFN LED reflow solde Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables...
Calidad Paquete programable del estallido del kilovatio X Ray Machine For SMT BGA QFP del CNC 1,0 Fábrica

Paquete programable del estallido del kilovatio X Ray Machine For SMT BGA QFP del CNC 1,0

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” ...
Calidad Tamaño de punto encapsulado de la electrónica X Ray Machine los 5μm de la resistencia de los componentes Fábrica

Tamaño de punto encapsulado de la electrónica X Ray Machine los 5μm de la resistencia de los componentes

Factory Manufacturing X Ray Machine 5μM For Resistance Applications Electrical / mechanical components Electronic components SMT assemblies Pharmaceuticals Automotive assemblies Agriculture Counterfeit inspection Cell phone battery inspection BGA Inspection Inspection of over molded electrical ...
Calidad máquina Unicomp AX8500 del rayo de 2.5D 110kv X para la calidad del leadframe de Semicon que comprueba con la medida auto Fábrica

máquina Unicomp AX8500 del rayo de 2.5D 110kv X para la calidad del leadframe de Semicon que comprueba con la medida auto

2.5D 110kv X ray machine Unicomp AX8500 for Semicon leadframe quality checking with auto measurment Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm ...
Calidad radiografía de los 5μm Microfocus con FPD 55° que inclina la visión para examinar vacío que suelda de PCBA BGA QFN LED Fábrica

radiografía de los 5μm Microfocus con FPD 55° que inclina la visión para examinar vacío que suelda de PCBA BGA QFN LED

5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight ...