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Calidad Batería de litio off-line X Ray Machine 100kv AX8800 ISO9001 Fábrica

Batería de litio off-line X Ray Machine 100kv AX8800 ISO9001

Cabinet Lithium Battery Automatic X-ray Inspection Machine AX8800 Applications: ● Lithium battery pole piece solder joint defect detection, ● Lithium battery batteries coiling case detection, ● BGA , CSP , LED , Flip Chip , Semiconductor, ● Battery Industry , Small Metal Casting, ● Electronic Connector Module, ● Aerospace Components , Photovoltaic Industry , ● Other Special Industries. Aftersales service: Ø A professional service team Ø Country-wide network Ø 24/7 hotline Ø

Calidad Alta penetración NDT X Ray Machine Unicomp UNC160S 160kv para las zapatas de freno de los coches Fábrica

Alta penetración NDT X Ray Machine Unicomp UNC160S 160kv para las zapatas de freno de los coches

Unicomp UNC160S Real Time DR High penetration X-Ray machine for cars brake pads non-destructive testing of crack void porosity flaw Our goal is to solve inspection problems with tailored systems, while guaranteeing a premium post-sales service. More than 15 years of expertise in industrial (NDT) and electronics applications combined with experienced engineers result in solutions that set new industry standards. Discover the invisible! 1. All Unicomp x-ray systems have CE

Calidad 0.5kW electrónica multifuncional X Ray Machine For Electricity Products Fábrica

0.5kW electrónica multifuncional X Ray Machine For Electricity Products

0.5kW Multifunctional Electronics X Ray Machine For Electricity Products Multifunctional compact size X-ray Inspection System for electricity products&small casting parts quality checking Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm

Calidad Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) Fábrica

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA)

Unicomp AX9100max Electronics X Ray Machine FOR Flip-Chip BGA (FCBGA) The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application

Calidad Unicomp AX9100max X-ray Machine 130kV For IGBT Testing Fábrica

Unicomp AX9100max X-ray Machine 130kV For IGBT Testing

Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance

Calidad Unicomp AX9100max X-ray Machine For Cylindrical Power Cell Fábrica

Unicomp AX9100max X-ray Machine For Cylindrical Power Cell

Unicomp AX9100max X-ray Machine For Cylindrical Power Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp X-ray AX9100max Functions and Features Functions and features of Unicomp X-ray AX9100max Inspection Image Sample inspection image from Unicomp X-ray AX9100max Technical Parameters and

Calidad Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array Fábrica

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array

Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application fields

Calidad Radiografías Unicomp AX8300 de alta resolución de 110 KV para análisis no destructivo de juntas de soldadura BGA Fábrica

Radiografías Unicomp AX8300 de alta resolución de 110 KV para análisis no destructivo de juntas de soldadura BGA

High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free

Calidad Inspección baja de la avería 225KV NDT X Ray Machine Automotive Aircraft Vessel Fábrica

Inspección baja de la avería 225KV NDT X Ray Machine Automotive Aircraft Vessel

Unicomp X ray NDT Machine Automotive Aircraft Vessel Inspection Systems UNC225π Features: ● High reliable and long life,low breakdown ● High definition and resolution FPD ● C-arm fixture design enabling five-axis motion detection(optional automatic lift and descend) ● Multi-functional workstation,360°rotation and shift ● User friendly software design for easy interfacing can facilitate,customized software ● High penetration,Voltage up to 225KV,Maximum penetration thickness up