x ray detector
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Coloque el gabinete solo AX8200B de la máquina de la inspección del rayo de la batería X del juguete del teléfono
Stand Alone Phone Toy Battery X-ray Inspection Machine Cabinet AX8200B Features: ● Off-line lithium battery detection equipment ● 100KV 5μm closed X-ray tube, Hi-resolution detector ● X-ray tube and detector can be programmed to move to Z Axis ● Automatic control of all the moving parts, Automatic programming ● Convenient target point positioning system ● Automation software judgments detection Applications: ●Lithium battery pole piece solder joint defect detection, ●Lithium
Sistemas de inspección automáticos 40-120kV de X Ray de la seguridad de la fruta de la comida para la detección de la aguja
Food Safety Automatic X-ray Inspection Systems for Unpackaged Products Model UNF6040 Max Voltage 40-120kV Max Current 0.2-7.5mA Inspection Speed (m/min) 10-50 Inspection Accuracy(mm) Stainless steel ball ø0.5,Stainless steel wire 0.2x1.5, Glass2.0,Plastic 1.5 Image system Linear detector array Belt Food grade belt, length can be customized Tunnel Size(mm) 600x400 Max.Loading Weight 10kg Monitor 19' Dimension(WxDxH,mm) 1600x790x1800 Weight 500kg Safety
Cámara Unicomp X Ray 130kV de HD para examinar a tableros de PCBA
Application SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
el soldar de la electrónica X Ray Machine For SMT BGA de 0.8kW 5um FDA
X-Ray Inspection Machine Electronics BGA Standard Multifunction Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Applications:BGA , CSP , LED , Flip Chip , Semiconductor,Battery Industry , Small Metal Casting,Electronic Connector Module,Aerospace Components , Photovoltaic Industry,Other Special Industries. System
NDT que echa el diseño compacto de la máquina del NDT X Ray, resolución del detector de los 2.8LP/Mm
NDT Industrial X Ray Inspection Systems Compact Design Manufacturer Unicomp UNC320 is a compact industrial X-ray inspection system designed for broad aerospace and foundry (automotive) applications. Flexible 2D inspection of casting defects and production flaws provide the confidence of a safe and reliable analysis. Features: Reliable inspection decisions based on outstanding image quality High-speed wheel inspection of the heaviest wheels with our new gripper manipulator
Unicomp viste/ropa comida y los sistemas de inspección 40-120kV de la bebida X Ray
Unicomp clothes garments X-ray Inspection Systems in Food Processing Plants detecting foreign matter Unicomp Efficient X-ray inspection systems are available for systematic detection and elimination of foreign material. They help food makers safeguard consumer health, mitigate the risk for extensive recall campaigns, and make sure that the reputation of their brands and compliance with applicable regulations remain intact. X-ray inspection systems are used wherever defects
Control de defectos interno del foco de la electrónica X Ray de la electrónica micro del sistema SMT
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with
Alto sistema de la electrónica X Ray de la ampliación para la inspección del vacío de BGA CSP/QFN/PoP
Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing
Inspección interna programable de la calidad de la pelota de golf de la máquina de la electrónica X Ray de la detección del CNC
Application Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, Aluminium Die-casting, Moulding Plastic. SMT, BGA, CSP, Flip Chip, LED Detection. Features 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions pixels high resolution FPD Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification X-ray tube & detector automatic lifting and
