electronics x ray system
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Alta máquina eficiente de la inspección de BGA X Ray, sistemas de gabinete micro del foco X Ray
Micro-focus x-ray cabinet systems BGA X-Ray Inspection Machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle Views 360° rotary fixture (Optional) X-ray Leakage
Alta resolución en línea de la máquina de la inspección de BGA X Ray con el generador integrado
Online BGA inspection system with integrated generator X-Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5.Well-trained and Professional after-sales service team to support you.
99,9% bandeja de la alta exactitud X Ray Chip Counter For Quad Reel/JEDEC/paquete del tubo
Over 99.9% high accuracy One-button operation of X-ray Chip Counter for quad reel, JEDEC tray , Tube package Main Configuration of Chip Counter 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer
SMD componente X Ray Counter Machine CX7000L con el AI dinámico que cuenta algoritmo
Free Component library with dynamic AI Counting algorithm of SMD X-ray Chip Counter CX7000L Main Configuration of Chip Counter CX7000L 1. Bar-code Scanner 2. X-ray System 3. Label Printer 4. Finger Printer Recognition System Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line
Telecontrol inteligente completamente automático de la nube de Unicomp X Ray Chip Counter CX7000L para el componente
Unicomp fully automatic Intelligent X-ray Chip Counter CX7000L for component counting with Cloud of Remote support Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows OS , i7 CPU Monitor 22” LCD X-Ray Tube Max. Voltage 80
Contador automático del microprocesador de la inspección X Ray de CX7000L que conecta con MES ERP WMS
Rich Experience On Connecting With MES, ERP and WMS of Chip Counter CX7000L Technical Data of CX7000L Equipment Features Footprint (W*D*H) / Machine Weight 1000 mm*1370 mm*1962 mm / 1160 kg Package Plywood Case, 110 cm*145 cm*210 cm, Total 1450 kg Power Consumption 1.1kW Power Supply AC 110~220V (±10%) 50Hz Working Mode Off-line System Computer Operating System Industrial PC, Windows OS , i7 CPU Monitor 22” LCD X-Ray Tube Max. Voltage 80 kV Max. Current 700 μA Focal Spot Size
Cadena de producción en línea equipo en tiempo real de X Ray, prueba del Ndt de la radiografía de 160KV X Ray
Online Production Line Real Time X Ray Inspection Equipment System 160KV Whether in the automotive, electronics or aircraft industry or for ship and vessel construction, Unicomp Technology is offering industrial X-ray inspection systems for nondestructive material testing which can fit in any manufacturing process and guarantee highest quality and safety standards for industrial products. 1. Full cycle support from products design to testing procedures and high-quality
Consumo de energía del sistema AX8200 0.8kW de la máquina de la inspección del semiconductor BGA X Ray del ccsme
EMS Semiconductor BGA X Ray Inspection Machine System AX8200 Features: ● 100KV 5μm X-ray tube, image intensifier with 2 mega pixels CCD camera. ● Motion controls include: ±60° tilt motion, X/Y table motion plus Z axis tube and detector movement. ● Multi-function DXI image processing system ● X/Y programming function for multiple image inspection routines ● Max. loading area 510mm x 420mm, max. detection area 435 x 385mm with ~300X System Magnification. ItemDefinitionSpecsSyst
Defectos de lanzamiento de aluminio del bastidor X Ray Inspection Machine For Cavities
Cavities Casting defects Metal X Ray Machine Industrial Quality Management Unicomp Technology automated x-ray systems inspect steel or aluminum alloy castings expressly for the automotive industry. The automated radioscopic inspection of aluminum die castings can be performed for an audit-based or production-level scale. Inspection System for Die Casting, Automotive Components, Defense Components, Cultural Assets and Large Products Appropriate for medium•large size component
