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Calidad Máquina de la inspección de Unicomp AX8200max X Ray para la inspección de defectos del arnés de cables Fábrica

Máquina de la inspección de Unicomp AX8200max X Ray para la inspección de defectos del arnés de cables

Unicomp AX8200max X-ray Inspection machine for Wire Harness Defects Inspection Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace ...

Calidad trazado del CNC de la batería de litio 1uSv/H X Ray Inspection Equipment BGA Fábrica

trazado del CNC de la batería de litio 1uSv/H X Ray Inspection Equipment BGA

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200B The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...

Calidad Unicomp AX8200 100KV X Ray Scanning Machine For BGA CSP Fábrica

Unicomp AX8200 100KV X Ray Scanning Machine For BGA CSP

X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” ...

Calidad Inspección falsificada el ccsme BGA X Ray Machine For Electronics Components Fábrica

Inspección falsificada el ccsme BGA X Ray Machine For Electronics Components

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 Item Definition Specs System Parameters Size 1080(L)x1180(W)x1730(H)mm Weight 1150kg Power 220AC/50Hz Power Consumption 0.8kW X-ray Tube Type Closed Max.Voltage 90kV/100kV Max.Power 8W Spot Size 5μm X-ray System Intensifier ...

Calidad IC BGA CSP Inspección de defectos de embalaje Radiografía AX8300 UNICOMP Escaneo automático CNC completo Fábrica

IC BGA CSP Inspección de defectos de embalaje Radiografía AX8300 UNICOMP Escaneo automático CNC completo

IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV ...

Calidad CSP X Ray Inspection Machine 90kV para soldar de la célula solar Fábrica

CSP X Ray Inspection Machine 90kV para soldar de la célula solar

SMT X-Ray Closed 5g Chipset Electronic Resistance Inspection Machine AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes ...

Calidad Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis Fábrica

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse ...

Calidad Imagen de inspección de rayos X de súper resolución sobre la inspección interna de la antena con nuestro modelo de gran venta AX7900 Fábrica

Imagen de inspección de rayos X de súper resolución sobre la inspección interna de la antena con nuestro modelo de gran venta AX7900

AX7900 Super Resolution X-Ray Inspection System for Antenna Internal Inspection The UNICOMP AX7900 X-Ray Inspection System delivers superior resolution imaging for comprehensive internal inspection of antenna components and other electronic assemblies. System Overview Equipped with a 90kV/5μm ...

Calidad Detector 130KV de SMT BGA X Ray Detection Equipment Flip Chip FPD para Semicon Fábrica

Detector 130KV de SMT BGA X Ray Detection Equipment Flip Chip FPD para Semicon

Application Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Features 130kV (Option 110KV) 7µm closed X-ray tube, high ...

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