bga x ray inspection system
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Sistema de inspección de la radiografía de Bga de la placa madre con área de la inspección de la extra grande
Extra large inspection area and plenty of power PCB X RAY Machine for BGA The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Coloque el sistema solo 40W del tratamiento de la imagen de la máquina DXI de la inspección del vacío BGA X Ray
Application Aluminium Die-casting, Moulding Plastic. Semiconductor, Packaging components, Battery Industry, Electronic components, Automotive parts, Photo-voltaic, SMT, BGA, CSP, Flip Chip, LED Detection Ceramics, other special industries. Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Tilt detection with 55° and rotation 360°operation together with 6 axis movement Multi-function DXI image processing system,
PCBA que suelda velocidad de la máquina de la inspección de BGA X Ray con la tabla grande de la muestra
Application Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Aluminium Die-casting, Moulding Plastic. Electronic components, Automotive parts, Photo-voltaic, Ceramics, other special industries. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement 130kV (Option 110KV) 7µm closed X-ray tube, high speed & Millions
Sistema de inspección de SMT Bga X Ray del semiconductor para la detección interna de los defectos
Application Aluminium Die-casting, Moulding Plastic. Ceramics, other special industries. Semiconductor, Packaging components, Battery Industry, SMT, BGA, CSP, Flip Chip, LED Detection Electronic components, Automotive parts, Photo-voltaic, Features X-ray tube & detector automatic lifting and descending, with convenient target point positioning system Multi-function DXI image processing system, CNC programmable detection 130kV (Option 110KV) 7µm closed X-ray tube, high speed &
100kV PCBA X Ray Inspection System Unicomp Electronics para el vacío/soldar de BGA
Unicomp Electronics High Resolution PCBA X-Ray Efficient Inspection for BGA Void, Soldering Quality Specifications: Item Description Specifications X-Ray Tube Max. Voltages, Type 90kV, Closed (100kV Optional) Power Consumption 8W Focal Spot Size 5 μm Motion range (Up and Down) 150mm Magnification 600X Detector Intensifier 4”/2” (FPD Optional) Resolution 77/110 LP/cm Camera 200 Mega Pixel CCD Motion range (Up and Down) 290mm System Operating System Industrial PC, Win 7, i7
Reforzador micro de la máquina FPD de la mesa X Ray del foco de PCBA, cobertura de la radiografía de 48m m x de 54m m
Benchtop Electronics PCBA micro-focus BGA X Ray Inspection Machine OUR SERVICE 1.Your inquiry will be replied in 12 hours. 2.Original Manufacture to customers, with competitive price. 3.We provide one year warranty, free training and whole life technology support. 4.We can arrange the shipment by air, DHL,Fedex, UPS, and by Sea,etc for you, and will give you the tracking NO. after shipment. 5.Well-trained and Professional after-sales service team to support you. 6.Manual will
Detector X Ray Inspection System 0.8kW BGA de Flawer para la lámpara del vehículo LED
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
Foco micro Unicomp X Ray Machine AX7900 para la inspección de SMT BGA Semicon IC
High Magnification cost effective Micro Focus X-ray machine AX7900 for SMT BGA and Semicon IC inspection Specifications of Xray machine: System Summary Footprint 1200(W)×1200(D)×1500(H)mm Machine Weight 1130 kg Power Supply AC 110/220V, 50/60Hz Plywood Packing Size 1350(W)×1350(D)×1800(H)mm Packing Weight 1330 kg Power Consumption 1.3 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD)
Máquina de AX7900 Unicomp X Ray tubo cerrado del punto del foco de 5 micrones para la inspección de SMT BGA QFN IC
5 micron focus spot closed type tube X-Ray machine Unicomp AX7900 for SMT BGA QFN IC inspection Description of IC Xray machine AX7900: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection
