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Calidad Máquina de rayos X de PCB SMT de alta resolución tamaño de punto de enfoque de micrón Unicomp AX7900 para inspección de calidad y grietas dentro del teléfono celular Fábrica

Máquina de rayos X de PCB SMT de alta resolución tamaño de punto de enfoque de micrón Unicomp AX7900 para inspección de calidad y grietas dentro del teléfono celular

SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX7900 for cellphone inside quality and cracks inspection Description of IC X Ray machine AX7900: It finds extensive application across multiple sectors such as BGA, CSP, Flip Chip technology, LEDs, Fuses, Diodes, PCBs, Semiconductors, the Battery Industry, small-scale metal casting, electronic connector modules, cables, aerospace components, and the Photovoltaic Industry, among others. FEATURES of IC Xray

Calidad Máquina de rayos X de 90KV Micron Focus Spot Tube Máquina de rayos X Unicomp Modelo AX7900 mejorado con computadoras duales para verificar la calidad del teléfono celular Fábrica

Máquina de rayos X de 90KV Micron Focus Spot Tube Máquina de rayos X Unicomp Modelo AX7900 mejorado con computadoras duales para verificar la calidad del teléfono celular

90KV micron focus spot size tube X-ray machine Unicomp upgraded model AX7900 with dual computers for checking the cellphone quality Description of IC X Ray machine AX7900: It has broad applications spanning BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small metal casting, electronic connector modules, cables, aerospace parts, and the photovoltaic industry, among other fields. FEATURES of IC Xray machine AX7900: Laser Pinpoint Inspection

Calidad Área de detección efectiva 129x129mm Equipo de inspección de rayos X para navaja eléctrica 1280x1220x1615mm Fábrica

Área de detección efectiva 129x129mm Equipo de inspección de rayos X para navaja eléctrica 1280x1220x1615mm

X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It finds extensive application in numerous domains, encompassing BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, small-scale metal casting, electronic connector modules, cables, aerospace components, and the photovoltaic industry, among others. FEATURES of IC Xray machine AX7900: A Large-Scale Laser Pinpoint Inspection Table for Accurate Localization

Calidad Equipo de inspección de rayos X de sistema de aumento 600X para navajas eléctricas con tamaño de píxeles de 85 μm Fábrica

Equipo de inspección de rayos X de sistema de aumento 600X para navajas eléctricas con tamaño de píxeles de 85 μm

X-Ray Inspection Equipment for Electric Razor Description of IC X Ray machine AX7900: It is broadly utilized in various sectors such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small-scale Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, and more. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC Programming

Calidad Equipo de inspección de rayos X de tubo sellado para PCBA de 0 a 90 kV de voltaje ajustable Fábrica

Equipo de inspección de rayos X de tubo sellado para PCBA de 0 a 90 kV de voltaje ajustable

X-Ray Inspection Equipment for PCBA Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm Effective Detection Area 130*130mm Frame Rates 20fps

Calidad Equipo de inspección de rayos X para PCBA de tamaño de punto de enfoque de 5 μm Capacidad de 1100 kg Fábrica

Equipo de inspección de rayos X para PCBA de tamaño de punto de enfoque de 5 μm Capacidad de 1100 kg

X-Ray Inspection Equipment for PCBA Description of IC X Ray machine AX7900: It is widely employed across multiple industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Manufacturing, Small Metal Casting, Electronic Connector Modules, Cables, Aerospace Components, Photovoltaic Industry, among others. FEATURES of IC Xray machine AX7900: Laser Pinpointing System on a Large Inspection Table for Precise Positioning Accurate Control, CNC

Calidad Actualización al detector de panel plano Equipo de inspección de rayos X FPD para IC con matriz de píxeles de 1536 * 1536 mm Fábrica

Actualización al detector de panel plano Equipo de inspección de rayos X FPD para IC con matriz de píxeles de 1536 * 1536 mm

X-Ray Inspection Equipment for IC Description of IC X Ray machine AX7900: It has extensive applications in diverse fields such as BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Production, Miniature Metal Casting, Electronic Connector Assemblies, Wiring, Aerospace Parts, and Photovoltaic Industry, to name a few. FEATURES of IC Xray machine AX7900: Precision Positioning Laser Pointer System Installed on a Large Inspection Table Accurate Control, CNC

Calidad Máquina de rayos X Unicomp AX9100max 220AC 50Hz para escalada de estaño Fábrica

Máquina de rayos X Unicomp AX9100max 220AC 50Hz para escalada de estaño

Unicomp AX9100max X-ray Machine For Tin Climbing The Unicomp AX9100max X-ray Machine is specifically designed for tin climbing applications, offering advanced inspection capabilities for various industries. Application Fields Widely applied for: BGA, CSP, Flip Chip LED, Fuse, Diode PCB, Semiconductor Battery Industry Small Metal Casting Electronic Connector Module Cables Photovoltaic Industry Application fields of Unicomp X-ray AX9100max Functions and Features Functions and

Calidad Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis Fábrica

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis

Unicomp AX9100max X-ray Inspection System For Flip-Chip BGA (FCBGA) Packaging Analysis The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application