pcb inspection system
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Vehículo LED que enciende X Ray Inspection Machine 0.8kW para la comprobación de la calidad que suelda
EMS Semiconductor Unicomp X-Ray Inspection System Electronics BGA AX8200 The AX-8200 machine is designed to provide high resolution x-ray imaging primarily for the electronics industry. This versatile system is effective for many applications within the PCB manufacturing process. This includes BGA, CSP, QFN, Flip Chip, COB and the wide range of SMT components. The AX-8200 is a powerful support tool for process development, process monitoring and refinement of the rework
CSP 130kV X Ray Security Scanner Auto Inspection para el NDT de cerámica
130kV clsoed tube X-ray system with convenient mapping process for ceramic NDT quality testing Technical Parameters and Specifications System Summary Footprint 2595(W)×1392(D)×1992(H)mm Machine Weight 1900 kg (X-Ray) / 700kg (Conveyor) Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 180(W)×170(D)×190(H)cm (X-Ray) 150(W)×105(D)×120(H)cm (Conveyor) Packing Weight 2000kg (X-Ray) / 800kg (Conveyor) Power Consumption 3.5 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage
El soldar de Unicomp AX8500 X Ray Inspection Machine For SMT el ccsme BGA LED CSP QFN
Unicomp AX8500 X-ray inspection machine for SMT / EMS BGA LED CSP QFN soldering void measurement Technical Parameters and Specifications System Summary Footprint 1370(W)×1300(D)×1700(H)mm Machine Weight 1600 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1500(D)×2000(H)mm Packing Weight 1800 kg Power Consumption 2.0 kW X-Ray Tube Tube Type Sealed Max. Power 25W Voltage 0~110kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector
Tubo Unicomp X Ray AX7900 0.8KW de PCBA 5um para la asamblea del PWB
Unicomp 5um close tube AX7900 X-ray for printed circuit board assembly PCBA process quality inspection of Void Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement standard with ±60° tilt motion (option). Z axis movement for x-ray tube & FPD to increase/decrease magnification/FOV. Convenient target point positioning system. Multi-function DXI image processing system with XY programming for multiple image inspection routines. Max.
Sistema de inspección por rayos X de 90 KV FPD certificado por CE/FDA para la detección de defectos en los condensadores
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, PCB, Flip Chip, LED, Fuse, Diode, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Máquina de rayos X electrónica de inspección automática programable CNC Unicomp AX9100MAX para medición de curvatura IC
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors,
Calentador de FPD 130kV X Ray Inspection Machine For Cartridge
Application Widely applied for BGA , CSP , Flip Chip, LED , Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. Features Max. loading area φ570mm, max. inspection area 450mm*450mm, with 1600X Magnification Tilt detection with 55° and rotation 360°operation together with 6 axis movement X-ray tube & detector automatic lifting and descending, with convenient target point
Máquina digital de rayos X en tiempo real AX7900 para la inspección de defectos internos del condensador
Wire Harness Quality Detection AX7900 Electronics Unicomp X Ray Equipment Description of IC X-Ray machine AX7900: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospace Components, Photovoltaic Industry, etc. APPLICATION of IC Xray machine AX7900: FEATURES of IC Xray machine AX7900: Technical Specifications of AX7900 Item Definition Specs System Summary Footprint 1200
Máquina de prueba de componentes de precisión omnidireccional IC de inspección de cables de enlace AX9100 UNICOMP
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
